Technical Specifications
- Silica gel Thickness: approx. 5 mm.
- Heat Insulation Pad. Resistant to high temperature of up to 500 °C.
- It has special areas for small screws, IC Chip and other small parts.
- Also, Suitable for working with hot air gun and for Heat Gun BGA Soldering stations
- Built-in scale ruler (0 to 36 cm ) on top section
Warranty:
N/A- Consumable
